Led 3d curved lead frame of illumination device

ABSTRACT

A 3D curved structure and LED 3D curved lead frame for a curved surface illumination of an illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3D illumination curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the LED chip on the installation seat to get LED flat lead frame, then flex the conductive metal into LED 3D curved lead frame with jig and paste on the luminous curved surface, and package them with transparent material.

CROSS-REFERENCE

This application is a continuation application of U.S. patentapplication Ser. No. 13/734,603 filed on Jan. 4, 2013, which claimed aforeign priority to the patent application of Taiwan No. 101101175 filedon Jan. 12, 2012.

SUMMARY OF THE INVENTION

This invention is to separately produce the complicated 3D curvedstructure and LED 3D curved lead frame, spread the curved luminouscircuit into plane circuit, and utilize conductive metal charge tape toproduce lead frames of single layers and accumulate into bandedstructure of multilayer lead frame, and install LED chip on theinstallation seat and form LED flat lead frame, then use ductility andplastic deformation features of conductive metal to flex into LED 3Dcurved lead frame, and paste on the complicated curved surface of themetal part, package into one body with transparent materials such ashardened resin or silica gel, for example, decorative lighting, curveddisplay advertising board and other curved illumination devices; thismethod offers more flexibility for structure and aesthetic design, andfully utilizes the high heat dissipation capacity of main body of metalpart.

PRIOR ART

LED chip has been used very commonly in recent years. These LED chipsinclude: packaged LED, SMD LED and bare chip LED, in which electrodecontact of packaged LED includes two-contact or plural contact. Thosewith exposed electrode pin can be divided into two-row upright type orhorizontal type; SMD LED belongs to surface mounted package. Those withelectrode pins on the underside of chip package and not stretched outand exposed, such as PLCC/SMD/SMT, are called chip LED; bare chip LEDbelongs to bare chips, which can be further divided into coplanarelectrode, top and bottom plane electrode and flip chip electrodeaccording to the position of electrode contact. Bare chip LED must beinstalled on one specific baseplate and package with transparentmaterial; the number of bare chips of internal package of the abovepackaged LED and SMD LED can be more than one chip, containingprotective Zener diode, in addition, the chip arrangement can beparallel connection, series connection, and mixing of series andparallel connection; and the illumination colors of LED chip containmonochromatic, multicolor and white light, in which white light can begot from more than three pieces of multicolor LED chips or got by addingfluorescent powder on LED chip, and multicolor can be got mainly fromRGB chips, sometimes, other chips will be added to meet the colordemand, or white light chip assembly is directly added.

These LED chips can be installed in many ways according the application,for example, ceramic baseplate, hard printed circuit board (PCB),flexible PCB, plastic baseplate and flexible wire; packaged LED is ofteninstalled on the flexible wire. SMD LED can be applied for most ofpurposes, such as ceramic baseplate, hard PCB, flexible PCB and plasticbaseplate.

The conductive adhesives commonly used for installation of LED chipincludes solder paste, conductive adhesive and high-molecular conductiveadhesive. After installing these conductive adhesives on electrodecontact of installation position, install LED chip to get the weldingeffect through heating and solidification.

For the LED chips applied on multicolor advertising board, one method isto directly weld the LED chips with different colors on high densitymultilayer PCB, and directly drive these chips with drive baseplate anddrive computer to generate multicolor image with high resolution;another method is to add the necessary circuit on bare LED chips anddrive chips with several colors and package them together. The drivemethod will be changed into serial communication method. The resolutionof this method is limited by the chip size, but the manufacturing costcan be greatly reduced, and this chip assembly also contains white lightchip.

LED chips are used in broad scope including illumination, advertisingboard and multicolor decorative lighting, especially illuminationapplication, but they are limited by illumination direction of LED, sothe program that can realize even light scattering has become one of keypoints in prior art; concerning prior art of advertising board, inaddition to improvement of high resolution and bright color. Thecylinder-shape advertising boards consisting of several PCBs are alsocommonly seen in prior art; for the prior art in relation to multicolordecorative lighting, in addition to common multicolor light bar, thenewest 3D circuit technology has been introduced to enable plasticinjection molded luminaire to generate chemical plating orelectroplating metal conductive circuit on their curved surface so thatthe LED chip can be installed on the curved surface.

Relevant illumination device program of prior art is explained asfollows:

Prima Facie Case 1:

Taiwan Patent Application No. 200914762 entitled “LED luminaire and itspedestal” filed in 2009 relates to the illumination demand of streetlamp to state that the pedestal of luminaire consists of adjacent andsuccessive multiplane baseplate with unequal dip angle, install at leastone packaged LED in each plane to enable each LED light source to beunder electric control according to the angle of projection, and eachLED projection light in one specific area and to be overlapped with theadjacent LED light, thus accomplishing continuous, successive and evenillumination effect and spreading the illumination scope. The lamphousing surface is equipped with heat dissipating fin; the multiplanebaseplate curved surface of this Prima Facie Case offers the detailedpractice for the light distribution and improvement, but the peripheryof multiplane baseplate is installed on the positioning frame of insideperiphery of lamp housing. In addition, one transparent lamp shade isequipped on the bottom of lamp housing, which is able to cover theperiphery of multiplane baseplate, enabling the heat generated from LEDchip on the plane baseplate not to be rapidly dissipated from the heatdissipating fin of lamp housing surface.

Prima Facie Case 2:

U.S. Pat. No. 7,443,678B2 entitled “Flexible PCB with heat sink” filedin 2008 uses flexible PCB, which is equipped with circuit substrate,heat conduction substrate and radiator on its top. In its flexible PCB,the first trough of heat conduction substrate and the second trough ofthe radiator will provide the buffer space when this flexible PCB isbending. There is one platform between the troughs of heat conductionsubstrate for carrying the circuit substrate. When this Prima Facie Caseis used in high power LED illumination device, the focusing position oflight will be adjusted as trough width is folded; the embodiment of thisPrima Facie Case indicates that the flexible PCB can provide cylindricallight source structure of different focusing radius. But the 3D curvedor spherical application is not further explained.

Prima Facie Case 3:

Taiwan Patent No. 339252 relates to “Illumination module of LEDluminaire” filed in 2011. This Prima Facie Case is featured by makingthe light ejection axle of each LED illumination member face to thisreflector, thus enabling LED luminaire to illuminate more evenly; andthe radiator base is equipped with fan to increase the heat dissipatingeffect of stream guidance surface. The newly increased fan of this PrimaFacie Case makes convection cooling effect enhanced, but cooling fan andother parts should be increased. In addition, the angle of projectionlight of LED illumination member is likely more than 100 conicity,unless the reflector has enough length or special design, that is, partof light will be directly projected to outside, and a part of light willbe projected on the reflector, and multiple reflection will also causeattenuation of illumination, and the irregular reflection surfacerequired by the reflector will result in more difficulty and cost.

Prima Facie Case 4:

China Patent No. 1719095A relates to “LED ball lighting lamp” filed in2006. This Prima Facie Case installs flexible PCB of LED chip on thespherical or multilateral spherical surfaces of engineering plastics,and cover or package into LED spherical lamp with transparent materialoutside the sphere. This Prima Facie Case is perhaps used for decorationlamp or illumination, but further instructions are not available, butdissipation program required for high power LED illumination; inaddition, another similar patent: Taiwan Utility Patent No. M385637 of“New type of LED light source structure” filed in 2010, which installedthe several flexible PCBs on LED illumination assembly, and installed onthe external surface of the sphere and other intervals, thus resultingin full-spherical illumination effect.

Prima Facie Case 5:

Japan Patent Application No. JP2011096594A relates to “Bulb type ledlamp” filed in 2011. This Prima Facie Case is featured by setting up theprojecting multiplane structure on the top end of frame body of thebulb, another multiplane shell structure sunk in the center of insidecan be compacted and cup jointed on the outer surface of this projectingstructure. LED chip is installed on each external surface ofconstruction part of this shell, and the structure of this multiplaneshell is made by flexing the metal plate with circuit, and preservedwith electrode contact to link with the circuit of frame body to broadenradiation scope of LED light source and enhance the heat dissipationcapacity; the heat of LED chip of this Prima Facie Case is scatteredfrom frame body, but the number of the installed LED chips when higherbrightness is required will become more. The arrangement of series andparallel circuit between LED chips should be explained more definitely;another similar patent is Taiwan Utility Patent No. M405524 relates to“LED three-dimensional bulb” filed in 2011, this patent also has similarrising structure and several inclined loading surfaces at differentdirection of the circumference. LED light source body is installed inthese loading surfaces.

Prima Facie Case 6:

Taiwan Utility Patent No. M343884 relates to “the ring-shaped compositestructure of LED advertising board” filed in 2008. This invention isabout the ring-shaped composite structure of one kind of LED advertisingboard, this LED advertising board consists of plural baseplate andplural illumination module, and the baseplates can respectively fixed onring-shaped support. The luminous surface of such illumination module isconnected with interstitial-free ring-shaped display surface so that thewords and patterns presented on this ring-shaped display surface can bewatched in different angles, and the words and patterns have coherence;the illumination module of this Prima Facie Case contains monochromaticLED, white light LED and RGB full-color LED. It is known from numeroussignal pins of illumination module that, precise multilayer PCB must beused to install these numerous LEDs, and the control signal of thebaseplate should be also used to enable the annular display surface toaccomplish dynamic display effect, but it is still limited by PCB andunable to obtain the display function of 3D curved surface.

Prima Facie Case 7:

Germany Patent No. DE202010008460U1 relates to “Modulierte LEDAnzeigetafelanordnung and deren System” filed in 2011. This Prima FacieCase is one kind of modularized LED display board structure and itssystem. The flexible PCB is equipped with plural full-color LED units toform one matrix, and the signal connection among modularized LED displayboards is used to form large-scale LED display system; this Prima FacieCase adopts full-color LED chip unit containing drive mechanism, so thedisplay function can be acquired only from the flexible board, but it isstill limited by flexible PCB, causing that the display function of 3Dcurved surface cannot be produced.

Prima Facie Case 8:

Taiwan Design No. D141427 relates to “LED luminaire” filed in 2011. ThisPrima Facie Case is one kind of LED luminaire made of 3D circuit. Theappearance feature is that the lamp socket appears semi-arc shaped 3Dcurved surface, 3D curved surface has 3D circuit, LED is placed on 3Dcircuit under the arrangement of specific patterns, and emerging lightalso appears as 3D linear distribution; LED luminaire of this PrimaFacie Case uses three-dimensional molded interconnect device (3D-MID),and the method is laser direct structuring (LDS). The laser willdirectly draw 3D circuit diagram on the activated plastic surface, andthe activated plastic surface can form conductive circuit with chemicaldeposition method, which needs large quantity of chemical liquidmedicine to get enough thickness of conductive circuit, or need manytimes of different liquid medicine to deposit different conductive metalon the circuit, that is, the manufacturing method faces environmentalprotection problem like PCB. PCT Patent Application No. WO2011041934A1relates to “Semiconductor carrier structure” filed in 2011 also adoptssimilar method, and it is unable to utilize the heat dissipationcapacity of metal part either.

Prima Facie Case 9:

Taiwan Patent Application No. 100142476 relates to “Integratedillumination part and lead frame of umbrella” filed in 2011. This PrimaFacie Case is one kind of annular lead frame installed with LED chip,used to install on the surface of main body of umbrella part, and bothones are packaged together. The feature is to first produce LED leadframe on tabular conductive metal, then bend into annular lead frame forbeing installed on the umbrella part, this feature is suitable forseries and parallel connection of composite circuit and installation thesurface of circumferential plane; this Prima Facie Case does not conductfurther invention for the application of curved surface illumination.

The above solutions just explain the demands of LED chip applied inluminaire or advertising board, which are settled and introduced asfollows:

Demand 1: Heat Dissipation

For example, Prima Facie Case 2, Prima Facie Case 3 and Prima Facie Case5 have the solutions in relation to heat dissipation demand; Prima FacieCase 2 and Prima Facie Case 3 paste PCB on the metal part surface; andPrima Facie Case 3 even performs forced cooling with fan; and theluminous LED chip of Prima Facie Case 5 is really pasted and fixed onthe metal part surface. Heat dissipating effect of metal part cannot befully utilized due to low heat dissipation efficiency of PCB, soincrease of fan will increase the risk of part failure.

Demand 2: Distribution Direction of Illumination Light

For example, Prima Facie Case 1, Prima Facie Case 2, Prima Facie Case 4,Prima Facie Case 5, Prima Facie Case 8 and Prima Facie Case 9 depend on3D structure to accomplish the required illumination effect; some ofPrima Facie Cases have solutions in relation to heat dissipating demand,only the solution of Prima Facie Case 9 is relative concise, which canmeet the demand of 3D projection directions.

Demand 3: Decoration

For example, Prima Facie Case 4, Prima Facie Case 5, Prima Facie Case 8and Prima Facie Case 9 have solutions in relation to the decorationdemand of LED luminaire, and all of these solutions use 3D structure andmulticolor LED chip to accomplish the required decoration effect, butcomplicated 3D curved illumination structure is not further explained.

Demand 4: Easy Manufacturing and Installation

For example, Prima Facie Case 4 pastes flexible PCB on spherical plan,Japanese patent of Prima Facie Case 5 first installs LED chip andcircuit on the metal plate, then use flexing method of metal plate, forexample, Prima Facie Case 8 directly uses LDS to establish circuit andweld LED chip on the plastic curved surface. For example, Prima FacieCase 9 first produces LED lead frame on tabular conductive sheet metal,then bend into annular lead frame to be installed on the umbrella part.These Prima Facie Cases separate the production of 3D structure and LEDillumination device, but no further explanation is provided for thesolution for complicated 3D illumination curved surface, and Prima FacieCase 8 can be only used for plastic parts, which cannot use metal partto dissipate heat.

Demand 5: Multicolor Advertising Board

For example, Prima Facie Case 6 uses LED module structure to constituteannular display panel, and accomplish dynamic display via controlbaseplate. For example, Prima Facie Case 7 uses full-color LED chip unitthat contains drive mechanism, so only serial communication method isused to accomplish dynamic display function of advertising board onflexible printed circuit (FPC), but FPC is only suitable for flat orcylindrical surface, which is unable to meet the demand of 3D curvedadvertising board.

Prima Facie Cases of the above prior art propose solutions for thespecific demands, and there is no more flexible practice that can meetthe demand of complicated 3D illumination curved surface. This inventionconducts research and development for the aforementioned demands,introduces the concept of separated production of complicated curvedsurface structure and LED 3D curved lead frame of 3D illumination curvedsurface, enabling the innovative 3D curved lead frame to fully meet theabove five demands when it is applied in LED illumination device,without environmental protection of chemical plating or electroplatingmetal wire.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates external structure of white light luminaire inaccordance with the first embodiment of the present invention.

FIG. 2 illustrates profile structure of white light luminaire inaccordance with the first embodiment of the present invention.

FIG. 3(A) illustrates layered structure of white light LED flat leadframe used in the first embodiment of the present invention, the circuitis in series connection and then parallel circuit.

FIG. 3(B) illustrates layered structure of white light LED flat leadframe used in the first embodiment of the present invention, the circuitis in parallel connection and then series circuit.

FIG. 3(C) illustrates profile structure of conductive through hole andinsulating through hole of white light LED flat lead frame used in thefirst embodiment of the present invention.

FIG. 4 illustrates external structure of multicolor luminaire used inthe second embodiment of the present invention.

FIG. 5 illustrates profile structure of multicolor luminaire used in thesecond embodiment of the present invention.

FIG. 6(A) illustrates layered structure of multicolor LED flat leadframe diagram used in the second embodiment of the present invention.

FIG. 6(B) illustrates structure of conductive through hole and powercontact of multicolor LED flat lead frame used in the second embodimentof the present invention.

FIG. 7(A) illustrates structure of multicolor LED curved displayadvertising board module used in the third embodiment of the presentinvention.

FIG. 7(B) illustrates structure of multicolor LED circumferentialspherical advertising board used in the third embodiment of the presentinvention.

FIG. 8 illustrates LED chip used in the third embodiment of the presentinvention.

FIG. 9 illustrates layered structure of multicolor LED flat lead frameof display advertising board used in the third embodiment of the presentinvention.

FIG. 10 illustrates structure of charge tape of white light LED flatlead frame used in the fourth embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

This invention separately produces the complicated 3D curved structureand LED 3D curved lead frame to meet the illumination demand ofcomplicated curved surface of illumination device, thus enabling theproducing difficulty in installing LED chip and circuit on illuminationcurved surface to be substantially reduced, structure and aestheticdesign flexibility to be bigger, and fully utilizing the high heatdissipation capacity of main body of metal part.

The key to this method is the bent strip-shaped circuit made ofmultilayer lead frame, and the circuit can meet the demand of seriesconnection, parallel connection and mixing of series and parallelconnection, that is, it can very easily depict the bent strip-shapedcircuit on the illumination curved surface. The circuit of complicated3D curved surface can be cut into many circuit units, and can 3D curvedcircuit pattern of each circuit unit can be spread into one planecircuit pattern.

Plane circuit, that is, the spread plane strip-shaped circuit hasmultilayer lead frame accumulated by conductive sheet metal, and theconstituting plane circuit pattern can be concentric circles curve,repeated arrangement curve or other types of patterns. The installationseat of multilayer lead frame is installed with LED chip to get LED flatlead frame. The light of LED chips on these circuit patterns will alsomeet the demand of the original illumination curved surface.

Because the conductive metal of multilayer lead frame has ductility andplastic deformation features, LED flat lead frame can be flexed into LED3D curved lead frame with jig, and pasted on the required illuminationcurved surface. For complicated curved surface, multi-disc 3D curvedlead frame can be used to form the required curved surface of luminoussurface, then package into one body with transparent materials such ashardened resin or silica gel, for example, decorative lighting, curveddisplay advertising board and other 3D curved illumination devices.

Multilayer lead frame is one electrical insulation flaky conductivemetal multilayer circuit structure accumulated by multidisc monolithiclead frames, and conductive metal underside and thickness broadside ofmonolithic lead frame have electric insulating layers, and theappearance is the bent strip-shaped and contains installation seat ofLED chip, which is suitable for the bent strip-shaped circuit design ofcomplicated illumination curved surface.

The structure of monolithic lead frame must meet the demand of seriescircuit, parallel circuit and mixed series and parallel circuit, thatis, the circuit in the multilayer lead frame structure consists ofmonolithic lead frames with different structure, and as required bymixed series and parallel circuit. The length of monolithic lead framewill be divided into several circuit sections isolated by insulatingjoint according to the demand, and the length and shape of each circuitsection will not be same or similar for sure. It is hereinafter referredto as circuit section in order to meet the demand of mixed series andparallel circuit, each single-layer lead frame is consisted of at leastone or more circuit sections.

The part of each circuit section structure can be assembled in differentways according to the purpose and circuit demand, which may contain:wire, power contact, installation seat, conductive through hole,insulating through hole, potential chain contact and signal contact,which will be assembled by the above parts or all parts according to thedemand, and each assembled position should have at least one or moreparts; the main position is one or more installation seats, which isconnected by plural pieces of wire. Power contact, signal contact andother positions are located on one end of circuit section, which is usedto connect control circuit and signal circuit; conductive through hole,insulating through hole and potential chain contact are located on wireor installation seat, which are used to meet the demand of circuit'sseries connection, parallel connection, and mixed series and parallelcircuit.

Where the installation seat wire of circuit section is equipped withinsulating joint, one circuit section will be divided into severalconductive sheet metals isolated by insulating joint conductive sheetmetals. In addition, the installation seat wire is respectively equippedwith electrode contact of one group of high and low potential, then suchcircuit section can apply to serial lead frame with series circuit.

The installation seat wire of circuit section is changed into integratedwire, appearing strip shape, hollow annular or rectangular or solidtabular shape, electrode contact of one group of high or low potentialis equipped above, then such circuit section can apply to parallelcircuit, which can provide high or low potential for mixed series andparallel circuit, belonging to continuous lead frame.

To enable the multilayer-superimposed lead frame to meet the demand ofmixed series and parallel circuit, the wire, installation seat,potential connecting point or power contact will be equipped withconductive through hole and insulating through hole to constitute highpotential or low potential contact.

The conductive through hole is used to prime conductive adhesive toenable the circuit section's conductive metal of the lead frame with twosuperimposed pieces on the top and bottom to have the same potential.The conductive through hole is only installed on the lead frame thatrequires the same potential, and the superimposed lead frame on rockbottom does not have any conductive through hole. When conductiveadhesive is totally filed in the conductive through hole, thesuperimposed lead frames will have the same potential.

Where circuit section's conductive metal of lead frame with over twosuperimposed layers up and down in the middle layer ofmultilayer-superimposed lead frame need to be connected into the samepotential with conductive through hole. The other layers above must beinsulated. Other layers of these different potential will be installedwith insulating through hole with aperture more than conductive throughhole and inner wall with insulating layer to ensure other conductivemetal of lead frame that should be insulated will not be broke overconductive adhesive is injected.

When the circuit section of multilayer-superimposed lead frame that needthe same potential is not located under the superimposed up and downrelation, conductive through hole should be penetrated into conductivemetal wire and pasted with conductive adhesive to ensure to get therequired the same potential. The lead frame on the bottom layer does nothave any conductive through hole but directly contacts conductive metalwire and is connected and broken over with conductive adhesive, andother monolithic lead frames with different potential are equipped withinsulating through holes to enable the conductive metal wire to passthrough, and the inner wall has insulating layer, which will not causebreak-over situation; if conductive through hole is installed on thepotential connecting point or power contact, and both ones are locatedat broadside of wire or installation seat and stretched outward. Theother monolithic lead frames with different potential will not needinsulating through hole, only conductive metal wire should be penetratedin conductive through hole with the assistance of conductive adhesive.

Where the lead frame with over two superimposed pieces ofmultilayer-superimposed lead frame has series circuit, the insulatingjoint of wire on installation seat of each single-layer lead frameshould be mutually staggered to ensure structure intensity of thesuperimposed installation seat to meet the demand for installing LEDchip.

After the installation seat of multilayer lead frame superimposed byeach single-layer lead frame is superimposed. The electrode contact oninstallation seat wire should be mutually staggered, and high and lowelectrode contact is separately located on relative positions to formmultiple high and low potential electrode contact groups to join theelectrode contact on the LED chip, and the electrode contact is flexedon the same horizontal position in order to install the LED chip.

Another purpose of the present invention is to further explain themethod that sheet metal is produced into similar cellular charge tape tomanufacture LED flat lead frame, and use embodiment to give detailedexplanation for the manufacturability of the manufacturing method of thepresent invention and prove the flexibility for small-scale production.Processing method of LED flat lead frame is explained as follows:

LED curved illumination device of the present invention is to properlydesign to LED circuit to be designed, then spread the circuit patternshape on the curved surface into circuit pattern of plane structure. Itis possible to divide the curved circuit diagram into over one piece ofcircuit pattern of plane structure as required, each circuit pattern inthis place is designed into one circuit with curve banded structure, andeach circuit contains the possible position combination of monolithicsingle-layer lead frame structure, enabling the circuit of eachsingle-layer lead frame to be drawn on different strip-shaped sheetmetals, and each sheet metal to produced into charge tape with machiningmethod; the section thickness of main body of strip-shaped conductivemetal is from more than 0.05 mm to less than 2 mm, and section width isfrom more than 1 mm to less than 10 mm; conductive metal contains:ferrous metal, non-ferrous metal and copper foil sheet with insulatinglayer; for the convenience of production, the common practice is toproperly arrange the patterns of single-layer lead frame on banded metalplate, and increase the plural required connecting parts with differentshapes to enable circuit conductive sheet metals of each single-layerlead frame to be connected as cellular charge tape structure, andprocessed into cellular charge tape with location hold for superimposingmultilayer charge tapes and installing LED chip. It is hereinafterreferred to as charge tape, according to different demand of LED chip,and the demand of circuit under parallel connection, series connectionand mixed series and parallel connection. The conductive sheet metalstructure of each piece of charge tape can be designed in different waysaccording to the demand.

According to the demand of LED chip and circuit, superimpose the chargetapes of multilayer, then install LED chip. Each layer of charge tapehas heat conduction insulating layer, such as insulating varnish, toprevent short circuit. The multilayer charge tape will have excellentstructural rigidity after being bonded with insulating heat conductioncement, suitable for installation of LED chip and further processing.

After the superimposed charge tapes are installed on the jig, LED chipcan be installed on the installation seat. Inject conductive adhesive oneach electrode contact of each installation seat and paste LED chip,conduct heating and solid jointing to make LED chip stable and fixed,thus cutting off the connecting part on the charge tape and cutting thepart into individual part, at this time, the multilayer-superimposed LEDplane wire will be obtained.

The solution proposed of the present invention can improve the functionsof LED curved illumination device and accomplish the following effects:

Effect 1. The wire of LED 3D curved lead frame and the underside ofinstallation seat are pasted on main body surface of the part, which canprovide large-area heat dissipating efficiency, and main body structureof the part makes it easier to design heat dissipating method with upand down convection.

Effect 2. LED 3D curved lead frame can be installed according to thecurved surface of light projection direction, with no need to considerhow to respectively install each LED chip on the complicated curvedsurface, thus easily designing the required brightness distributionmethod and increasing lots of aesthetic designs.

Effect 3. The aesthetic design space of main part body of LED curvedillumination device can be substantially improved, no problem aboutdifficulty in LED chip installation, because LED 3D curved lead framecan be completely adhered on the complicated curved surface of main partbody, even can be conveniently packed with transparent materials,especially multilayer-superimposed lead frame structure will be moresuitable to use multicolor LED chip to enable the illumination device toaccomplish optical and aesthetic effects.

Effect 4. The mass production of lead frame charge tape made ofconductive metal charge tape can meet the demand of small-scaleproduction, especially small-scale ornament can be processed by means oflaser cutting or water jet cutting or CNC machinery cutting, andlarge-scale products can be produced with precise stamping die, evenremoving the mass production requirements for chemical process andenvironmental pollution problem caused by chemicals.

Effect 5. When full-color LED chip unit that contains drive mechanism isused for LED 3D curved lead frame, dynamic display advertising boardfunction will be realized on various curved or spherical planes. Theinterval between chips is relatively big. The resolution will slightlyreduce, but LED 3D curved lead frame can be produced into curved andspherical planes with different sizes, and serial communication methodhas been widely applied in the industrial circles so that the settingcost can be substantially reduced.

Implementation Method

In order to give a specific explanation of LED 3D curved lead frame ofillumination device of the present invention. The following embodimentswill be used for further revealing, but it is not subject to thefollowing embodiments. For the sake of clear explanation, the thicknessof insulating layer in the descriptions of the following embodiments isnot the actual thickness, which is used for explanation only. All partscan meet the necessary requirements for electric insulation and electricsafety.

Embodiment 1 is LED 3D curved lead frame of the present inventionapplied in white light luminaire with function of illumination curvedsurface.

Please refer to FIG. 1 and FIG. 2, the external structure diagram ofwhite light luminaire of Embodiment 1 of the present invention.Luminaire 1 contains aluminum alloy main body 10; illumination curvedsurface 11, heat dissipating fin 12, LED 3D curved lead frame 2 a,spiral joint 17, white light LED chip 91, and transparent package 15;when the luminaire in this embodiment is installed on the ceiling. Thespiral joint 17 is located at the top; illumination curved surface 11 islocated at the bottom, and illumination curved surface 11 becomesspherical shape and connects with heat dissipating fin 12. LED 3D curvedlead frame 2 a is installed on illumination curved surface 11. Thesurface has transparent package 15, which is used to protect LED 3Dcurved lead frame 2 a and LED chip 91, and 12 white light LED chips 91is installed in installation seat 24 to form mixed series and parallelcircuit. Power hole 111 on illumination curved surface 11 of LED chip 91is used to make power wire connected from inside of main body 10 topower contact 231 and power contact 232 of LED 3D curved lead frame 2 a.Main body 10 has outward extended heat dissipating fin 12, firstextending downward to lateral part of heat dissipating fin 121 atexternal broadside. Illumination curved surface 11 is equipped with airhole 112 in the middle to enable the heat generated from white light LEDchip 91 on LED 3D curved lead frame 2 a to be directly transferred toheat dissipating fin 12 via aluminum alloy illumination curved surface11, that is, the heat can be directly dissipated from the back ofillumination curved surface 11 and the surface of heat dissipating fin12. Because white light LED chip 91 and illumination curved surface 11are located below, when the heat is transmitted to heat dissipating fin12. The external surface of heat dissipating fin 12 will heat the air toenable the hot air to ascend and flow due to buoyancy along lateral partof heat dissipating fin 121 at external broadside, that is, the cold airwill constantly flow in through air hole 112 to cool the back ofillumination curved surface 11 and heat dissipating fin 12; if luminaire1 is installed at the opposite direction. The cooled air will also flowat the opposite direction, and large quantity of hot air will flow outthrough air hole 112; these air flows can reduce the thickness ofthermal boundary layer of heat dissipating surface, and increase heatconvection coefficient and help the heat dissipation; because LED 3Dcurved lead frame 2 a is installed on the projecting illumination curvedsurface 11, light projection direction of luminaire 1 will be veryeasily controlled according to radius of curvature of illuminationcurved surface 11. The bigger the radius of curvature is, the moreuniform the light will project downward; and the smaller the radius ofcurvature is, the bigger light projection angle will be; if illuminationcurved surface 11 is indented spherical surface. The bigger the radiusof curvature is, the longer focusing distance of light will be; and thesmaller radius of curvature is, the shorter focusing distance of lightwill be; if the brightness distribution of projection light should befurther controlled, the circuit can be further divided into loop insmaller unit to generate more uniform projection light; because theposition of white light LED chip 91 on illumination curved surface 11 isdesigned according to the demand of light projection, then design therequired circuit on illumination curved surface 11, and spread curvedcircuit into plane circuit and produce into LED flat lead frame 2 (asper FIG. 3(A)). Therefore, LED 3D curved lead frame 2 a can be correctlypasted on illumination curved surface 11 with insulating heat conductioncement 28 (as per FIG. 3(C)) in order to ensure the distribution ofprojection light is in conformity with the original design, and ensureto have the maximum heat dissipating area.

Please refer to FIG. 2, profile structure diagram of white lightluminaire of Embodiment 1 of the present invention. When the luminaireof this embodiment is installed on the ceiling, spiral joint 17 islocated at the top, illumination curved surface 11 is located at thebottom, and illumination curved surface 11 appears spherical shape andconnects with heat dissipating fin lower part 122. LED 3D curved leadframe 2 a is installed on illumination curved surface 11. The surfacehas transparent package 15 that is equipped with air hole 151 andconnected with air hole 112; the inside of main body 10 is cylindricalspace 14, where is installed with control circuit 18 in order to providestable voltage and current to ensure the service life of white light LEDchip 91. The high potential electrode contact is connected to powercontact 171 on the front end of spiral joint 17 via wire 182, and thelow potential electrode contact is connected to broadside of spiraljoint 17 via wire 181; the space between cylindrical space 14 of mainbody 10 and illumination curved surface 11 is connected with heatdissipating fin lower part 122, enabling hot and cold air to generateconvection. The heat generated by white light LED chip 91 will be firstdissipated by heat dissipating fin lower part 122. Because the cooledair flow with natural convection is available. There will not be toomuch heat transmitted to cylindrical space 14 to influence controlcircuit 18, and the opening of cylindrical space 14 is sealed andcombined with spiral joint 17, enabling the heat generated by controlcircuit 18 to be dissipated via the wall surface of cylindrical space 14and lateral part of heat dissipating fin 121 (as per FIG. 1), and bothof them have big heat dissipating surfaces.

Please refer to FIG. 2, FIG. 3(A) and FIG. 3(C), layered structurediagram of white light LED flat lead frame of Embodiment 1 of thepresent invention. The circuit of this embodiment includes four groupsof three white light LED chips 91 under series connection and thenparallel connection, totaling 12 LED chips 91. LED flat lead frame 2 hasthe plane circuit spread from illumination curved surface 11, consistingof two linked concentric circle arc curves. The middle arc is installedwith four LED chips 91, and the peripheral arc is installed with eightLED chips 91, which are superimposed by three layers of monolithic leadframes 21.

High potential monolithic lead frame 21(H) belongs to continuous leadframe, which is used as high potential parallel contact of seriescircuit. Series circuit monolithic lead frame 21(W) is serial leadframe, which is divided into four series circuit sections by insulatingjoint 225 on wire 22 and used to constitute four groups of three whitelight LED chips 91 parallel circuit under series connection. Lowpotential monolithic lead 21(C) is continuous lead frame, which is usedas low potential parallel contact of series circuit.

The structure of high potential monolithic lead frame 21(H) containswire 22, installation seat 24 a, power contact 231 and other parts; thefront end of lead frame 21 is installed with one power contact 231 inorder to connect control circuit 18; lead frame 21(H) is equipped with12 installation seats 24 a that are connected with wire 22, andinstallation seat 24 a has hollow annular installation seat wire 241;wire 22 is installed with insulating through hole 26, which is used toavoid conductive adhesive 29 from high and low potential short circuit.The installation position is above conductive through hole 25 of eachcircuit section of series circuit monolithic lead frame 21(W); wire 22is also installed with conductive through hole 25. The installationposition is high potential end of each circuit section of series circuitmonolithic lead frame 21(W), which is used to drip conductive adhesive29 on high potential end of each circuit section of parallel monolithiclead frame 21(W), enabling monolithic lead frame 21(H) to becomeparallel contact of high potential.

The circuit in series circuit monolithic lead frame 21(W) is dividedinto four groups of parallel circuit sections with insulating joint 225under series connection of three white light LED chips 91; the structureof each circuit section contains wire 22, installation seat 24 b andother parts; each circuit section is equipped with three installationseats 24 b that are connected with wire 22, and installation seat 24 bis separated by insulating joint 245 and installation seat wire 241 toconstitute one group of electrode contact 243 of high and low potential;high potential wire 22 on the front end of each circuit section isconnected with conductive through hole 25 on high potential monolithiclead frame 21(H) by dripping conductive adhesive 29; low potential wire22 on the tail end of each circuit section is equipped with conductivethrough hole 25, and low potential monolithic lead frame 21(C) isconnected with conductive through hole 25 by dripping conductiveadhesive 29.

The structure of low potential monolithic lead frame 21(C) contains wire22, installation seat 24 c, low potential power contact 232 and otherparts; the tail end of lead frame 21 is installed with one low potentialpower contact 232, which is used to connect control circuit 18; leadframe 21(C) is equipped with 12 tabular installation seats 24 c andconnected with wire 22; conductive through hole 25 of monolithic leadframe 21(W) is dripped with conductive adhesive 29 to connect wire 22 oflow potential monolithic lead frame 21(C), thus constituting lowpotential parallel contact.

Wire 22 and installation seat 24 of each monolithic lead frame 21 of LEDflat lead frame 2 have the same overall dimension for superimposition.Installation seat 24 is superimposed by installation seat 24 a,installation seat 24 b and installation seat 24 c. After each high andlow potential electrode contact 243 is dripped with conductive adhesive29, LED chip 91 can be installed in the internal space. The underside ofmonolithic lead frame 21(C) is directly pasted on illumination curvedsurface 11 with insulating heat conduction cement 28.

Please refer to FIG. 2 and FIG. 3(B), layered structure diagram of whitelight LED flat lead frame of Embodiment 1 of the present invention. Thecircuit of this embodiment includes four groups of three white light LEDchips 91 under parallel connection and then series connection, totaling12 LED chips 91. LED flat lead frame 2 has the plane circuit spread fromillumination curved surface 11, consisting of two linked concentriccircle arc curves. The middle arc is installed with four LED chips 91,and the peripheral arc is installed with eight LED chips 91, which aresuperimposed by two layers of monolithic lead frames 31.

High potential monolithic lead frame 31(H) belongs to continuous leadframe, which is divided into four circuit sections with insulating joint325 on wire 32, and used as high potential of parallel circuit, but eachcircuit section has different potential. Low potential monolithic leadframe 31(C) belongs to continuous lead frame, which is divided into fourcircuit sections with insulating joint 325 on wire 32, and used as lowpotential of parallel circuit, but each circuit section has differentpotential; circuit sections of high and low potential constitute fourgroups of parallel circuit; and each parallel circuit depends on threechaining points 35 to accomplish series connection mechanism of high andlow potential. Connecting point 35 a of high potential monolithic leadframe 31(H) and connecting point 35 b of low potential monolithic leadframe 31(C) are connected via conductive through hole 25 by drippingconductive adhesive 29 (as per FIG. 3(C)) to constitute series circuit.

High potential monolithic lead frame 31(H) is divided into four circuitsections with insulating joint 325 on wire 32. The structure of eachcircuit section contains wire 32, installation seat 34 a, connectingpoint 35 a, power contact 231 and other parts; the first circuit sectionis equipped with power contact 231 to connect high potential and controlcircuit 18, front end of the rest circuit section is equipped withpotential connecting point 35 a, that is equipped with conductivethrough hole 25 above to connect potential chain contact 35 b of eachcircuit section of low potential monolithic lead frame 31(C) by drippingconductive adhesive 29; and each circuit section is equipped with threeinstallation seats 34 a and connected with wire 32, and one electrodecontact 343 of high potential is equipped on hollow annular installationseat wire 341 of installation seat 34 a.

low potential monolithic lead frame 31(C) is divided into four circuitsections with insulating joint 325 on wire 32; the structure of eachcircuit section contains wire 32, installation seat 34 c, connectingpoint 35 b, power contact 232 and other parts; and the tail end of thelast circuit section is equipped with one low potential power contact232, which is used to connect control circuit 18; the tail end of therest circuit section is equipped with potential connecting point 35 b,which is used to connect potential chain contact 35 a of each circuitsection of high potential monolithic lead frame 31(H); and each circuitsection is equipped with three installation seats 34 c and connectedwith wire 32, and one electrode contact 343 of low potential is equippedon hollow annular installation seat wire 341 of installation seat 34 c.

Wire 32 and installation seat 34 of each monolithic lead frame 31 of LEDflat lead frame 3 has the same overall dimension for superimposition.Installation seat 34 is superimposed by installation seat 34 a andinstallation seat 34 c. Electrode contact 343 on installation seat 34 aand installation seat 34 c is located in relative position to constituteone group of high and low potential electrode contact. Electrode contact343 is processed and flexed to enable both of them to be at the samelevel. After each high and low potential electrode contact 343 isdripped with conductive adhesive 29, LED chip 91 can be installed in theinternal space. The underside of monolithic lead frame 31(C) is directlypasted on illumination curved surface 11 with insulating heat conductioncement 28.

Embodiment 2 is LED 3D curved lead frame of the present invention thatis applied in multicolor luminaire with illumination curved surfacefunction.

Please refer to FIG. 4 and FIG. 5, external structure diagram ofmulticolor luminaire of the present invention Embodiment 2. Multicolorluminaire 5 contains aluminum alloy main body 10, illumination curvedsurface 11, heat dissipating fin 12, LED 3D curved lead frame 6 a,spiral joint 17, multicolor LED chip 92 and transparent package 15; whenthe luminaire of this embodiment is installed on the ceiling, spiraljoint 17 is located at the top, illumination curved surface 11 islocated at the bottom, and illumination curved surface 11 becomesspherical shape, which is connected with heat dissipating fin 12. LED 3Dcurved lead frame 6 a is installed on illumination curved surface 11.The surface has transparent package 15 that is used to protect LED 3Dcurved lead frame 6 a and multicolor LED chip 92; and multicolor LEDchip 92 is installed in installation seat 64. Power hole 111 onillumination curved surface 11 is used to enable power wire is connectedto power contact 631 and power contact 632 of LED 3D curved lead frame 6a from the inside of main body 10, which has outward extended heatdissipating fin 12, first protruding downward and extending to lateralpart of heat dissipating fin 121 at external broadside. The middle partof illumination curved surface 11 is equipped with air hole 112 toenable the heat generated from multicolor LED chip 92 on LED 3D curvedlead frame 6 a to be directly transmitted to heat dissipating fin 12 viaaluminum alloy illumination curved surface 11, that is, the heat can bedirectly dissipated from the back of illumination curved surface 11 andthe surface of heat dissipating fin 12 surface. Because multicolor LEDchip 92 and illumination curved surface 11 are located below, when theheat is transmitted to heat dissipating fin 12, external surface of heatdissipating fin 12 will heat the air to enable the hot air to ascend andflow due to buoyancy along lateral part of heat dissipating fin 121 atexternal broadside, that is, the cold air will constantly flow inthrough air hole 112 to cool the back of illumination curved surface 11and heat dissipating fin 12; if luminaire 5 is installed at the oppositedirection. The cooled air will also flow at the opposite direction, andlarge quantity of hot air will flow out through air hole 112; these airflows can reduce the thickness of thermal boundary layer of heatdissipating surface, and increase heat convection coefficient and helpthe heat dissipation; because LED 3D curved lead frame 2 a is installedon the projecting illumination curved surface 11, light projectiondirection of luminaire 5 will be very easily controlled according toradius of curvature of illumination curved surface 11. The bigger theradius of curvature is, the more uniform the light will projectdownward; and the smaller the radius of curvature is, the bigger lightprojection angle will be; if illumination curved surface 11 is indentedspherical surface, the bigger the radius of curvature is, the longerfocusing distance of light will be; and the smaller radius of curvatureis, the shorter focusing distance of light will be; if the brightnessdistribution of projection light should be further controlled, thecircuit can be further divided into loop in smaller unit to generatemore uniform projection light; because the position of white light LEDchip 92 on illumination curved surface 11 is designed according to thedemand of light projection, then design the required circuit onillumination curved surface 11, and spread curved circuit into planecircuit and produce into LED flat lead frame 6 (as per FIG. 6(A)).Therefore, LED 3D curved lead frame 6 a can be correctly pasted onillumination curved surface 11 with insulating heat conduction cement 28in order to ensure the distribution of projection light is in conformitywith the original design, and ensure to have the maximum heatdissipating area.

Please refer to FIG. 5, profile structure diagram of multicolorluminaire of the present invention Embodiment 2. The luminaire of thisembodiment is installed on the ceiling, spiral joint 17 is located atthe top, illumination curved surface 11 is located at the bottom, andillumination curved surface 11 becomes spherical shape, which isconnected with heat dissipating fin lower part 122. LED 3D curved leadframe 6 a is installed on illumination curved surface 11, transparentpackage 15 on its surface is equipped with air hole 151, and connectedwith air hole 112; the inside of main body 10 is one cylindrical space14, where is installed with control circuit 18, and used to providestable voltage and current to ensure the service life of multicolor LEDchip 92 and provide plural-section multicolor light switching function,containing the color change from any monochromatic light to white light.The high potential electrode contact is connected to power contact 171on the front end of spiral joint 17 via wire 182; the low potentialelectrode contact is connected to the broadside of spiral joint 17 withwire 181; the space between cylindrical space 14 of main body 10 andillumination curved surface 11 is connected with heat dissipating finlower part 122, enabling hot and cold air to generate convection. Theheat generated by white light LED chip 92 will be first dissipated byheat dissipating fin lower part 122. Because the cooled air flow withnatural convection is available, there will not be too much heattransmitted to cylindrical space 14 to influence control circuit 18, andthe opening of cylindrical space 14 is sealed and combined with spiraljoint 17, enabling the heat generated by control circuit 18 to bedissipated via the wall surface of cylindrical space 14 and lateral partof heat dissipating fin 121, and both of them have big heat dissipatingsurfaces.

Please refer to FIG. 5, FIG. 6(A) and FIG. 6(B), layered structurediagram of multicolor LED flat lead frame of Embodiment 2 of the presentinvention. The circuit of this embodiment includes four groups of threemulticolor LED chips 92 under series connection and then parallelconnection, totaling 12 multicolor LED chips 92. LED flat lead frame 6has the plane circuit spread from illumination curved surface 11,consisting of two linked concentric circle arc curves. The middle arc isinstalled with four LED chips 92, and the peripheral arc is installedwith eight LED chips 92, which are superimposed by seven layers ofmonolithic lead frames 61.

High potential monolithic lead frame 61(HR) belongs to continuous leadframe, which is used as red light high potential parallel contact ofseries circuit. Series circuit monolithic lead frame 61(R) is seriallead frame, which is divided into four series circuit section withinsulating joint 625 on wire 62, and used to constitute red light seriescircuit of four groups of three LED chips 92.

High potential monolithic lead frame 61(HG) belongs to continuous leadframe, which is used as green light high potential parallel contact ofseries circuit. Series circuit monolithic lead frame 61(G) is seriallead frame, which is divided into four series circuit sections withinsulating joint 625 on wire 62, and used to constitute green lightseries circuit of four groups of three LED chips 92.

High potential monolithic lead frame 61(HB) belongs to continuous leadframe, which is used as blue light high potential parallel contact ofseries circuit. Series circuit monolithic lead frame 61(B) is seriallead frame, which is divided into four series circuit sections withinsulating joint 625 on wire 62, and used to constitute blue lightseries circuit of four groups of three LED chips 92.

Low potential monolithic lead frame 61(C) belongs to continuous leadframe, which is used as low potential parallel contact of each seriescircuit.

The structure of high potential monolithic lead frame 61(HR) containswire 62, power contact 631, high potential connecting point 621 a,installation seat 64 a and other parts; power contact 631 is installedon the front end of circuit, which is equipped with conductive throughhole 65 above; lead frame 61(HR) is equipped with 12 installation seats64 a, which are mutually connected with wire 62. Installation seat 64 ahas hollow annular installation seat wire 641; high potential connectingpoint 621 a is installed according to high potential connecting point621 b of series circuit monolithic lead frame 61(R). The conductivethrough hole 65 is equipped above; power contact 631 and conductivethrough hole 65 of high potential connecting point 621 a can be drippedwith conductive adhesive 29, which is used to connect power contact 631and high potential connecting point 621 b of monolithic lead frame 61(R)and enable to become parallel contact of high potential.

Series circuit monolithic lead frame 61(R) adopts insulating joint 625to divide the circuit into one group of four parallel circuit sectionsconnected with three multicolor LED chips 92 under series connection.The structure of circuit section contains wire 62, power contact 631,high potential connecting point 621 b, low potential connecting point648, installation seat 64 b and other parts; the front end of the firstcircuit section is installed with one power contact 631 and tail end isinstalled with one low potential chaining point 648. The front ends ofthe rest circuit sections are installed with one high potentialconnecting point 621 b and tail end is installed with one low potentialconnecting point 648. Conductive through hole 65 installed on lowpotential connecting point 648. Each circuit section has threeinstallation seats 64 b connected with wire 62, and installation seatwire 641 of installation seat 64 b is equipped with insulating joint 645to constitute one group of electrode contact of high and low potential643. The high potential of each circuit section is connected with powercontact 631 and high potential connecting point 621 b by drippingconductive adhesive 29 in conductive through hole 65 on monolithic leadframe 61(HR), and low potential of each group of circuit is connectedwith low potential connecting point 648 of connect monolithic lead frame61(C) by dripping conductive adhesive 29 in the conductive through hole65 via low potential connecting point 648 on monolithic lead frame61(R), and passing through conductive metal wire 67.

The structure of high potential monolithic lead frame 61(HG) containswire 62, power contact 631, high potential connecting point 621 a,installation seat 64 a and other parts; power contact 631 is installedon front end of the circuit that is equipped with conductive throughhole 65; lead frame 61(HG) is equipped with 12 installation seats 64 a,mutually connected with wire 62. Installation seat 64 a has hollowannular installation seat wire 641; high potential connecting point 621a is installed according to high potential connecting point 621 b ofseries circuit monolithic lead frame 61(G), which is equipped withconductive through hole 65 above; conductive through holes 65 of powercontact 631 and high potential connecting point 621 a can be drippedwith conductive adhesive 29, used to connect power contact 631 and highpotential connecting point 621 b of monolithic lead frame 61(G),enabling it to become parallel contact of high potential.

Series circuit monolithic lead frame 61(G) adopts insulating joint 625to divide the circuit into one group of four parallel circuit sectionsconnected by three multicolor LED chips 92 under series connection. Thestructure of circuit section contains wire 62, power contact 631, highpotential connecting point 621 b, low potential connecting point 648,installation seat 64 b and other parts; the front end of the firstcircuit section is installed with one power contact 631 and tail end isinstalled with one low potential chaining point 648. The front ends ofthe rest circuit sections are installed with one high potentialconnecting point 621 b and tail end is installed with one low potentialconnecting point 648. Conductive through hole 65 is installed on lowpotential connecting point 648. Each circuit section has threeinstallation seats 64 b, connected with wire 62, and installation seatwire 641 of installation seat 64 b is equipped with insulating joint 645to constitute one group of electrode contact of high and low potential643. The high potential of each circuit section is connected with powercontact 631 and high potential connecting point 621 b by drippingconductive adhesive 29 in conductive through hole 65 on monolithic leadframe 61(HG), and low potential of each group of circuit is connectedwith low potential connecting point 648 of connect monolithic lead frame61(C) by dripping conductive adhesive 29 in the conductive through hole65 via low potential connecting point 648 on monolithic lead frame61(G), and passing through conductive metal wire 67.

The structure of high potential monolithic lead frame 61(HB) containswire 62, power contact 631, high potential connecting point 621 a,installation seat 64 a and other parts; power contact 631 is installedon the front end of the circuit that is equipped with conductive throughhole 65; lead frame 61(HB) is equipped with 12 installation seats 64 a,mutually connected with wire 62. Installation seat 64 a has hollowannular installation seat wire 641; high potential connecting point 621a is installed according to high potential connecting point 621 b ofseries circuit monolithic lead frame 61(B), which is equipped withconductive through hole 65 above; conductive through holes 65 of powercontact 631 and high potential connecting point 621 a can be drippedwith conductive adhesive 29 to connect power contact 631 and highpotential connecting point 621 b of monolithic lead frame 61(B),enabling it to become parallel contact of high potential.

Series circuit monolithic lead frame 61(B) adopts insulating joint 625to divide the circuit into one group of four parallel circuit sectionsconnected with three multicolor LED chips 92 under series connection.The structure of circuit section contains wire 62, power contact 631,high potential connecting point 621 b, low potential connecting point648, installation seat 64 b and other parts; the front end of the firstcircuit section is installed with one power contact 631 and tail end isinstalled with one low potential chaining point 648. The front ends ofthe rest circuit sections are installed with one high potentialconnecting point 621 b and tail end is installed with one low potentialconnecting point 648. Conductive through hole 65 is installed on lowpotential connecting point 648. Each circuit section has threeinstallation seats 64 b, connected with wire 62, and installation seatwire 641 of installation seat 64 b is equipped with insulating joint 645to constitute one group of electrode contact of high and low potential643. The high potential of each circuit section is connected with powercontact 631 and high potential connecting point 621 b by drippingconductive adhesive 29 in conductive through hole 65 on monolithic leadframe 61(HR), and low potential of each group of circuit is connectedwith low potential connecting point 648 of connect monolithic lead frame61(C) by dripping conductive adhesive 29 in the conductive through hole65 via low potential connecting point 648 on monolithic lead frame61(B), and passing through conductive metal wire 67.

The structure of low potential monolithic lead frame 61(C) contains wire62, power contact 632, low potential connecting point 648, installationseat 64 c and other parts; power contact 632 installed on tail end ofthe circuit; lead frame 61(C) is equipped with 12 installation seats 64c, mutually connected with wire 62. Installation seat 64 c is solidtabular; low potential chaining points 648 is installed according to lowpotential connecting point 648 of series circuit monolithic lead frame61, which can pass through each layer of conductive through hole 65 oflow potential connecting point 648 to install conductive metal 67 anddrip conductive adhesive 29 in the hold and connect low potentialconnecting point 648 of each single-layer series lead frame.

Wire 62 and installation seat 64 of each monolithic lead frame 61 of LEDflat lead frame 6 has the same overall dimension for superimposition.Installation seat 64 is superimposed by installation seat 64 a,installation seat 64 b and installation seat 64 c. Electrode contact 643of installation seat 64 b is located in relative position and flexed tothe same level to constitute one group of high and low potentialelectrode contact. The space can be used to install LED chip 92 andenable electrode contact to be fixed on each electrode contact bydripping conductive adhesive 29. The underside of monolithic lead frame61(C) is directly pasted on illumination curved surface 11 withinsulating heat conduction cement 28.

Embodiment 3 is LED 3D curved lead frame of the present invention thatis applied in curved or spherical multicolor advertising boards andillumination device.

Please refer to FIG. 7(A), FIG. 7(B), FIG. 8 and FIG. 9, multicolor LEDcurved display advertising board module structure diagram of Embodiment3 of the present invention. Multicolor advertising board module 7contains aluminum alloy main body curved surface 71 and LED 3D curvedlead frame 8 a. The circuit of this embodiment is 16×16 seriesconnection multicolor LED chip 93. LED 3D curved lead frame 8 a takesbanded structure to arrange in matrix shape on curved surface 71 underseries connection. Curved surface 71 of aluminum alloy main body isequipped with through hole 711, which enables power contact 831(V) andpower contact 834(G) as well as timing sequence contact 832(C) andsignal contact 833(S) of LED 3D curved lead frame 8 a to be connected tocontroller and image decoder of display system. Chip 93 is theintegrated package chip that contains drive chip and RGB three-colorchip and necessary circuit, and drive chip has serial communicationinterface (SD), timing sequence interface (CLK), high potentialinterface (VCC) and low potential interface (GND), which arerespectively represented by S, C, V and G. LED 3D curved lead frame 8 ais spread into LED flat lead frame 8, which is superimposed by fourlayers of monolithic lead frame 81.

Monolithic lead frame 81(V) of high potential interface (VCC) belongs tocontinuous lead frame, which is used as parallel connection highpotential contact 843(V) of LED chip 93. Installation seat wire 841 ofinstallation seat 84 a is hollow annular and installation seat wire 841is equipped with high potential contact 843(V), and used to joint highpotential contact (VCC) of LED chip 93.

Monolithic lead frame 81(S) of serial communication interface (SD) isserial lead frame, which is used to connect serial communicationinterface (SD) of LED chip 93. Hollow annular installation seat wire 841of installation seat 84 b is equipped with insulating joint 845 toconstitute one group of signal input and output contact 843(S) of serialcommunication interface, which is used to joint signal input contact(SDI) and signal output contact (SDO) of LED chip 93.

Monolithic lead frame 81(C) of timing sequence interface (CLK) is seriallead frame, which is used to connect timing sequence interface (CLK) ofLED chip 93. Hollow annular installation seat wire 841 of installationseat 84 b is equipped with insulating joint 845 to constitute one groupof input and output contact 843(C) of timing sequence interface, whichis used to joint timing sequence input contact (CLKI) and timingsequence output contact (CLKO) of LED chip 93.

Monolithic lead frame 81(G) of low potential interface (GND) belongs tocontinuous lead frame, which is used as parallel connection lowpotential contact 843(G) of LED chip 93. Installation seat wire 841 ofinstallation seat 84 a is hollow annular and equipped with low potentialcontact 843(G), which is used to joint low potential contact (GND) ofLED chip 93.

The structure of monolithic lead frame 81(V) of high potential interface(VCC) contains wire 82, power contact 831(V), installation seat 84 a andother parts; power contact 831(V) is installed on the front end of thecircuit; lead frame 81(V) is equipped with 16×16 installation seats 84a, mutually connected with wire 82. Installation seat 84 a has hollowannular installation seat wire 841, where is equipped with highpotential contact 843(V).

The structure of serial communication interface (SD) monolithic leadframe 81(S) contains wire 82, power contact 833(S), installation seat 84b and other parts; front end of monolithic lead frame 81(S) is installedwith one power contact 833(S); lead frame 81(S) is equipped with 16×16installation seats 84 b, mutually connected with wire 82. Installationseat 84 b has hollow annular installation seat wire 841, where isequipped with insulating joint 845, and respectively equipped with onegroup of serial communication contact 843(S).

The structure of timing sequence interface (CLK) monolithic lead frame81(C) contains wire 82, power contact 832(C), installation seat 84 b andother parts; front end of monolithic lead frame 81(C) is installed withone power contact 832(C); lead frame 81(C) is equipped with 16×16installation seats 84 b, mutually connected with wire 82. Installationseat 84 b has hollow annular installation seat wire 841, where isequipped with insulating joint 845, and respectively equipped with onegroup of timing sequence contact 843(C) of timing sequence interface.

The structure of low potential interface (GND) monolithic lead frame81(G) contains wire 82, power contact 834(G), installation seat 84 a andother parts; power contact 834(G) is installed on the front end of thecircuit; lead frame 81(G) is equipped with 16×16 installation seats 84a, mutually connected with wire 82. Installation seat 84 a has hollowannular installation seat wire 841, where is equipped with low potentialcontact 843(G).

Wire 82 and installation seat 84 of each monolithic lead frame 81 of LEDflat lead frame 8 has the same overall dimension for superimposition.Installation seat 84 is superimposed by installation seat 84 a andinstallation seat 84 b. Electrode contact 843 of installation seat 84 aand installation seat 84 b is located in relative position and flexed tothe same level to constitute LED chip 93 contact group. The space can beused to install LED chip 93 and fix each contact 843 by drippingconductive adhesive 29. The underside of monolithic lead frame 81(G) isdirectly pasted on illumination curved surface 71 with insulating heatconduction cement 28.

Please refer to FIG. 7(B), structure diagram of circumferentialspherical advertising board consists of multicolor LED curved displayadvertising board module of the present invention Embodiment 3. Thislegend illustrates one circumferential and curved display advertisingboard 7 a consists of four pieces of LED 3D curved lead frames 8 a inorder to explain that this innovative method can meet the demand ofvarious illumination curved surfaces; aluminum alloy main body 71 iscircumferential spherical structure. The inside can be installed withplural heat dissipating fins 72 to reinforce the heat dissipatingefficiency of LED chip 93; when white light LED chip 91 is used forillumination purpose, plural heat dissipating fins 72 can even exert theheat dissipating effect.

Embodiment 4 illustrates the manufacturing method of LED flat lead frameof white light LED luminaire of the present invention Embodiment 1.

Please refer to FIG. 10 and FIG. 3(A), the structure of charge tape 4 ofLED flat lead frame 2 of the present invention. LED flat lead frame 2consists of two connected concentric circle arc curves. The middle arcis installed with four LED chips 91. The peripheral arc is installedwith eight LED chips 91, superimposed by three layers of monolithic leadframe 21. The circuit contains 12 LED chips 91 connected by four groupsof three white light LED chips 91 under series connection and thenparallel connection. This figure aims to explain how to use charge tape4 to finish the production of each monolithic lead frame 21; charge tape4(H) of this embodiment is used to produce high potential monolithiclead frame 21(H), charge tape 4(W) is used to produce series circuitmonolithic lead frame 21(W), and charge tape 4(C) is used to produce lowpotential monolithic lead frame 21(C).

The patterns of the required single-layer lead frame 21 are respectivelyand properly arranged on three pieces of conductive sheet metals withthe same dimensions. The back of sheet metal has insulating layer 28 toprevent against circuit short circuit. Respectively conduct the firstprocessing of conductive sheet metal to get the prototype with basicdimension of lead frame 21. Each charge tape 4 is explained as follows:

Charge tape 4(H) uses connecting parts 494 with various shapes toconnect wire 22, installation seat 24 a and power contact 231 intocellular structure, and produce conductive through hole 65, insulatingthrough hole 26 and hollow ring-shaped installation seat wire 241 byprocessing.

Charge tape 4(W) uses connecting parts 494 with various shapes toconnect wire 22 and installation seat 24 b, and divide the circuit intoseveral sections with insulating joint 225 and insulating joint 245.Connected them with connecting part 494 into cellular structure, andproduce conductive through hole 65, insulating joint 225 and insulatingjoint 245 by processing.

Charge tape 4(W) uses connecting parts 494 with various shapes toconnect wire 22, installation seat 24 c and low potential power contact232 into cellular structure.

The prototype of flat lead frame at this time has been formed in chargetape 4, and there are plural prototypes are connected in series in onepiece of charge tape 4. At this time, processing surface of insulatingthrough hole 26 of charge tape 4(H) should be pasted with insulatingcement 28. Connecting part 494 of charge tape 4(W) can ensure stableposition of electrode contact 243 of high and low potential; broadside491 of each charge tape 4 is equipped with plural charge tape locatingholes 493. Install these three pieces of charge tape 4 on the jig andpaste them with insulating heat conduction cement 28. Wire 22 andinstallation seat 24 of each single-layer lead frame will besuperimposed due to the with the same dimensions, and hollow annularinstallation seat wire 241 of charge tape 4(H) enables installation seat24 a as the installation space of white light LED chip 91. Dripconductive adhesive 29 on each electrode contact 243 with gluedispersion machine to install white light LED chip 91, and dripconductive adhesive 29 in each conductive through hole 65, conductheating and solid jointing to enable white light LED chip 91 to bestably combined into series circuit and break-over parallel circuit,then cut off connecting part 494 to become LED flat lead frame 2, andboth ends have high potential power contact 231 and low potential powercontact 232.

What is claimed is:
 1. A kind of LED 3D curved lead frame ofillumination device, characterized in that the feature of LED 3D curvedlead frame is to depict the circuit of the bent strip-shaped multilayerlead frame on illumination curved surface. The circuit of complicated 3Dcurved can be divided into multiple circuit units, then spread 3D curvedcircuit pattern of each circuit unit into one plane bent strip-shapedcircuit, and produce into LED flat lead frame of multilayer lead framestructure, and wire and installation seat of each monolithic lead frameof LED flat lead frame have the same overall dimension forsuperimposition; the conductive metals of multilayer lead frame haveductility and plastic deformation features. LED flat lead frame can beflexed into LED 3D curved lead frame with jig, and pasted on therequired illumination curved surface, and then packaged into one bodywith transparent materials such as hardened resin or silica gel.
 2. TheLED 3D curved lead frame of illumination device as claimed in claim 1,wherein the LED flat lead frame is multilayer lead frame superimposed byconductive sheet metal. The installation seat is installed with LEDchip, and the patterns of bent strip-shaped circuit can be concentriccircles curve, repeated arrangement curve or other various patterns. Theprojection light of LED chips on these circuit patterns will also meetthe demand of original illumination curved surface.
 3. A kind of LED 3Dcurved lead frame of illumination device, wherein the manufacturingmethod of LED flat lead frame is explained as follows: to draw thecircuit of the bent banded structure of each monolithic lead frame ofmultilayer-superimposed lead frame on different strip-shaped sheetmetals. For the convenience of production, the common practice is toproperly arrange the patterns of monolithic lead frame on banded metalplate, and increase the plural required connecting parts with differentshapes to enable circuit conductive sheet metals of each single-layerlead frame to be connected as cellular charge tape structure, andprocessed into cellular charge tape with location hold for superimposingmultilayer charge tapes and installing LED chip. After all thesuperimposed charge tapes are installed on the jig for superimposing andinsulated cementing, LED chip can be installed on the installation seat,then infuse conductive adhesive on each electrode contact of eachinstallation seat and paste LED chip, conduct heating and solid jointingto make LED chip stable and fixed, thus cutting off the connecting parton the charge tape and cutting the part into individual part, at thistime, the multilayer-superimposed LED flat lead frame will be obtained.4. The LED 3D curved lead frame of illumination device as claimed inclaim 3, wherein the section thickness of main body of strip-shapedconductive metal is from more than 0.05 mm to less than 2 mm, andsection width is from more than 1 mm to less than 10 mm; conductivemetal contains: ferrous metal, non-ferrous metal and copper foil sheetwith insulating layer.